3D stacking of high-performance processors.
Philip G. EmmaAlper BuyuktosunogluMichael B. HealyKrishnan KailasValentin PuenteRoy YuAllan HartsteinPradip BoseJaime H. MorenoEren KursunPublished in: HPCA (2014)
Keyphrases
- signal processor
- embedded processors
- distributed memory
- parallel algorithm
- signal processing
- parallel computers
- parallel processing
- highly parallel
- scientific computing
- low power
- pc cluster
- single chip
- high end
- high performance computing
- parallel implementation
- search algorithm
- high reliability
- case study
- single processor
- cost effective
- website
- small sized
- multiprocessor systems
- parallel architecture
- parallel processors
- real time
- combining multiple
- high efficiency
- ensemble learning
- low cost