Dylan C. Stow

Publication Activity (10 Years)

Years Active: 2012-2019
Publications (10 Years): 12

Top Topics

Integrated Circuit

Internal Memory

Combining Classifiers

Design Guidelines

Top Venues

ACM Great Lakes Symposium on VLSI

Publications

Dylan C. Stow, Itir Akgun, Yuan Xie
Investigation of Cost-Optimal Network-on-Chip for Passive and Active Interposer Systems. SLIP (2019)
Dylan C. Stow, Amin Farmahini Farahani, Sudhanva Gurumurthi, Michael Ignatowski, Yuan Xie
Power Profiling of Modern Die-Stacked Memory. IEEE Comput. Archit. Lett. 18 (2) (2019)
Itir Akgun, Dylan C. Stow, Yuan Xie
Network-on-Chip Design Guidelines for Monolithic 3-D Integration. IEEE Micro 39 (6) (2019)
Dylan C. Stow, Itir Akgun, Wenqin Huangfu, Yuan Xie, Xueqi Li, Gabriel H. Loh
Efficient System Architecture in the Era of Monolithic 3D: Dynamic Inter-tier Interconnect and Processing-in-Memory. DAC (2019)
Xing Hu, Dylan C. Stow, Yuan Xie
Die Stacking Is Happening. IEEE Micro 38 (1) (2018)
Peng Gu, Dylan C. Stow, Prashansa Mukim, Shuangchen Li, Yuan Xie
Cost-efficient 3D Integration to Hinder Reverse Engineering During and After Manufacturing. AsianHOST (2018)
Jaya Dofe, Peng Gu, Dylan C. Stow, Qiaoyan Yu, Eren Kursun, Yuan Xie
Security Threats and Countermeasures in Three-Dimensional Integrated Circuits. ACM Great Lakes Symposium on VLSI (2017)
Dylan C. Stow, Yuan Xie, Taniya Siddiqua, Gabriel H. Loh
Cost-effective design of scalable high-performance systems using active and passive interposers. ICCAD (2017)
Peng Gu, Shuangchen Li, Dylan C. Stow, Russell Barnes, Liu Liu, Yuan Xie, Eren Kursun
Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges. ACM Great Lakes Symposium on VLSI (2016)
Dylan C. Stow, Itir Akgun, Russell Barnes, Peng Gu, Yuan Xie
Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space. ISVLSI (2016)
Dylan C. Stow, Itir Akgun, Russell Barnes, Peng Gu, Yuan Xie
Cost analysis and cost-driven IP reuse methodology for SoC design based on 2.5D/3D integration. ICCAD (2016)
Peng Gu, Dylan C. Stow, Russell Barnes, Eren Kursun, Yuan Xie
Thermal-aware 3D design for side-channel information leakage. ICCD (2016)
Max A. Korbel, Dylan C. Stow, Chris R. Ferguson, David Money Harris
Yield-driven minimum energy CMOS cell design. ACSCC (2012)