IEEE Micro

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Publications

volume 44, number 1, 2024

Sangyeob Kim, Soyeon Kim, Seongyon Hong, Sangjin Kim, Jiwon Choi, Donghyeon Han, Hoi-Jun Yoo
COOL-NPU: Complementary Online Learning Neural Processing Unit. IEEE Micro 44 (1) (2024)
Donghyeon Han, Junha Ryu, Sangyeob Kim, Sangjin Kim, Jongjun Park, Hoi-Jun Yoo
A Low-Power Artificial-Intelligence-Based 3-D Rendering Processor With Hybrid Deep Neural Network Computing. IEEE Micro 44 (1) (2024)
Joshua J. Yi
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part VIII: Patent Families. IEEE Micro 44 (1) (2024)
Jianqing Liu, Na Gong
Privacy by Memory Design: Visions and Open Problems. IEEE Micro 44 (1) (2024)
Tatsuya Kubo, Shinya Takamaeda-Yamazaki
Cachet: Low-Overhead Integrity Verification on Metadata Cache in Secure Nonvolatile Memory Systems. IEEE Micro 44 (1) (2024)
Reon Oshio, Sugahara Takuya, Atsushi Sawada, Mutsumi Kimura, Renyuan Zhang, Yasuhiko Nakashima
A Compressed Spiking Neural Network Onto a Memcapacitive In-Memory Computing Array. IEEE Micro 44 (1) (2024)
Shane Greenstein
After the Gold Rush. IEEE Micro 44 (1) (2024)
Hsien-Hsin S. Lee
Computing With COOL Chips. IEEE Micro 44 (1) (2024)
Ryusuke Egawa, Yasutaka Wada
Special Issue on COOL Chips. IEEE Micro 44 (1) (2024)
Cyrius Nugier, Vincent Migliore
Acceleration of a Classic McEliece Postquantum Cryptosystem With Cache Processing. IEEE Micro 44 (1) (2024)

volume 44, number 2, 2024

volume 44, number 3, 2024

Ravi Bhargava, Kai Troester
AMD Next-Generation "Zen 4" Core and 4th Gen AMD EPYC Server CPUs. IEEE Micro 44 (3) (2024)
Amir Gholami, Zhewei Yao, Sehoon Kim, Coleman Hooper, Michael W. Mahoney, Kurt Keutzer
AI and Memory Wall. IEEE Micro 44 (3) (2024)
Byeongho Kim, Sanghoon Cha, Sangsoo Park, Jieun Lee, Sukhan Lee, Shinhaeng Kang, Jinin So, Kyungsoo Kim, Jin Jung, Jong-Geon Lee, Sunjung Lee, Yoonah Paik, Hyeonsu Kim, Jin-Seong Kim, Won-Jo Lee, Yuhwan Ro, Yeongon Cho, Jin Hyun Kim, Joon-Ho Song, Jaehoon Yu, Seungwon Lee, Jeonghyeon Cho, Kyomin Sohn
The Breakthrough Memory Solutions for Improved Performance on LLM Inference. IEEE Micro 44 (3) (2024)
Sean Lie
Inside the Cerebras Wafer-Scale Cluster. IEEE Micro 44 (3) (2024)
Heiner Litz, Natalia Vassilieva
Special Issue on Hot Chips 2023. IEEE Micro 44 (3) (2024)
Hsien-Hsin S. Lee
An Incoming World of Decoupling Siliconomy. IEEE Micro 44 (3) (2024)
Shane M. Greenstein
The Worlds I See: Curiosity, Exploration, and the Discovery at the Dawn of AI - Fei-Fei Li (New York, NY, USA: Flatiron Books, 2023, 336 pp.). IEEE Micro 44 (3) (2024)
Ian Winfield, Tim Ouradnik, Joseph Madril, Michael Matthews, Guillermo Romero
High-Performance Cooling for Power Electronics via Electrochemical Additive Manufacturing. IEEE Micro 44 (3) (2024)
Jason Howard, Joshua B. Fryman, Shamsul Abedin
The First Direct Mesh-to-Mesh Photonic Fabric. IEEE Micro 44 (3) (2024)
Mahesh Subramony, David Kramer, Indrani Paul
AMD Ryzen 7040 Series. IEEE Micro 44 (3) (2024)
Michael Gibbs, Kieran Woodward, Eiman Kanjo
Combining Multiple Tiny Machine Learning Models for Multimodal Context-Aware Stress Recognition on Constrained Microcontrollers. IEEE Micro 44 (3) (2024)
Joshua J. Yi
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part X: Patent Families. IEEE Micro 44 (3) (2024)

volume 43, number 5, 2023

volume 43, number 6, 2023