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Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits.
Yibo Chen
Eren Kursun
Dave Motschman
Charles Johnson
Yuan Xie
Published in:
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2013)
Keyphrases
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integrated circuit
high speed
low cost
knowledge based systems
building blocks
cost effective
printed circuit boards
real time
neural network
case study
computer aided
planning problems
engineering design
technical systems