Ertugrul Demircan

Publication Activity (10 Years)

Years Active: 2001-2020
Publications (10 Years): 4

Top Topics

Automated Analysis

Vlsi Implementation

Top Venues

IEEE Trans. Very Large Scale Integr. Syst.

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

Publications

Shaoyi Peng, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan
Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis. Integr. 70 (2020)
Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan
Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37 (12) (2018)
Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan
Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. IEEE Trans. Very Large Scale Integr. Syst. 26 (5) (2018)
Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan
Voltage-based electromigration immortality check for general multi-branch interconnects. ICCAD (2016)
Ertugrul Demircan
Effects of Interconnect Process Variations on Signal Integrity. SoCC (2006)
Warren Grobman, Matt Thompson, Ruoping Wang, Chi-Min Yuan, Ruiqi Tian, Ertugrul Demircan
Reticle Enhancement Technology: Implications and Challenges for Physical Design. DAC (2001)