Zeyu Sun

Publication Activity (10 Years)

Years Active: 2016-2021
Publications (10 Years): 27

Top Topics

Failure Detection

Recent Advances

Class Probability Estimation

Top Venues

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao
A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40 (2) (2021)
Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39 (4) (2020)
Wentian Jin, Sheriff Sadiqbatcha, Zeyu Sun, Han Zhou, Sheldon X.-D. Tan
EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects. ICCD (2020)
Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao
Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. 28 (2) (2020)
Han Zhou, Shuyuan Yu, Zeyu Sun, Sheldon X.-D. Tan
Reliable Power Grid Network Design Framework Considering EM Immortalities for Multi-Segment Wires. ASP-DAC (2020)
Sheldon X.-D. Tan, Zeyu Sun, Sheriff Sadiqbatcha
Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip. IPSJ Trans. Syst. LSI Des. Methodol. 13 (2020)
Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan
Saturation-Volume Estimation for Multisegment Copper Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. 27 (7) (2019)
Han Zhou, Zeyu Sun, Sheriff Sadiqbatcha, Naehyuck Chang, Sheldon X.-D. Tan
EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks. IEEE Trans. Very Large Scale Integr. Syst. 27 (4) (2019)
Zeyu Sun, Han Zhou, Sheldon X.-D. Tan
Dynamic Reliability Management for Multi-Core Processor Based on Deep Reinforcement Learning. SMACD (2019)
Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
Reliability based hardware Trojan design using physics-based electromigration models. Integr. 66 (2019)
Zeyu Sun, Taeyoung Kim, Marcus Chow, Shaoyi Peng, Han Zhou, Hyoseung Kim, Daniel Wong, Sheldon X.-D. Tan
Long-Term Reliability Management For Multitasking GPGPUs. SMACD (2019)
Han Zhou, Yijing Sun, Zeyu Sun, Hengyang Zhao, Sheldon X.-D. Tan
Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires. ASP-DAC (2018)
Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan
Accelerating electromigration aging for fast failure detection for nanometer ICs. ASP-DAC (2018)
Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan
Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37 (12) (2018)
Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 26 (3) (2018)
Taeyoung Kim, Sheldon X.-D. Tan, Chase Cook, Zeyu Sun
Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy. Integr. 63 (2018)
Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun, Sheldon X.-D. Tan
Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires. SMACD (2018)
Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models. SMACD (2018)
Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim, Zeyu Sun, Chase Cook, Jörg Henkel
Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited). Integr. 60 (2018)
Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan
Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. IEEE Trans. Very Large Scale Integr. Syst. 26 (5) (2018)
Taeyoung Kim, Zeyu Sun, Hai-Bao Chen, Hai Wang, Sheldon X.-D. Tan
Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors. IEEE Trans. Very Large Scale Integr. Syst. 25 (9) (2017)
Jiangtao Peng, Hai-Bao Chen, Hengyang Zhao, Zeyu Sun, Sheldon X.-D. Tan
Dynamic temperature-aware reliability modeling for multi-branch interconnect trees. ASICON (2017)
Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
Leveraging recovery effect to reduce electromigration degradation in power/ground TSV. ICCAD (2017)
Chase Cook, Zeyu Sun, Taeyoung Kim, Sheldon X.-D. Tan
Finite difference method for electromigration analysis of multi-branch interconnects. SMACD (2016)
Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan
Invited - Cross-layer modeling and optimization for electromigration induced reliability. DAC (2016)
Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan
Voltage-based electromigration immortality check for general multi-branch interconnects. ICCAD (2016)
Taeyoung Kim, Zeyu Sun, Chase Cook, Jagadeesh Gaddipati, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan
Dynamic reliability management for near-threshold dark silicon processors. ICCAD (2016)