Shengcheng Wang

Publication Activity (10 Years)

Years Active: 2014-2022
Publications (10 Years): 9

Top Topics

Stochastic Domains

Machine Learning

Allocation Problems

Top Venues

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Haozhe Zhu, Bo Jiao, Jinshan Zhang, Xinru Jia, Yunzhengmao Wang, Tianchan Guan, Shengcheng Wang, Dimin Niu, Hongzhong Zheng, Chixiao Chen, Mingyu Wang, Lihua Zhang, Xiaoyang Zeng, Qi Liu, Yuan Xie, Ming Liu
COMB-MCM: Computing-on-Memory-Boundary NN Processor with Bipolar Bitwise Sparsity Optimization for Scalable Multi-Chiplet-Module Edge Machine Learning. ISSCC (2022)
Shengcheng Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori
Defect Clustering-Aware Spare-TSV Allocation in 3-D ICs for Yield Enhancement. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38 (10) (2019)
Shengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori
Multicast Testing of Interposer-Based 2.5D ICs: Test-Architecture Design and Test Scheduling. ACM Trans. Design Autom. Electr. Syst. 23 (3) (2018)
Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 26 (3) (2018)
Shengcheng Wang, Hengyang Zhao, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
Recovery-aware proactive TSV repair for electromigration in 3D ICs. DATE (2017)
Shengcheng Wang, Mehdi Baradaran Tahoori
Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 25 (10) (2017)
Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
Leveraging recovery effect to reduce electromigration degradation in power/ground TSV. ICCAD (2017)
Shengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori
Multicast Test Architecture and Test Scheduling for Interposer-Based 2.5D ICs. ATS (2016)
Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty
Thermal-aware TSV repair for electromigration in 3D ICs. DATE (2016)
Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori
Deadspace-aware Power/Ground TSV planning in 3D floorplanning. ICICDT (2015)
Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori
Stress-aware P/G TSV planning in 3D-ICs. ASP-DAC (2015)
Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty
Defect Clustering-Aware Spare-TSV Allocation for 3D ICs. ICCAD (2015)
Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori
P/G TSV planning for IR-drop reduction in 3D-ICs. DATE (2014)