Xin Huang

Publication Activity (10 Years)

Years Active: 2013-2017
Publications (10 Years): 9

Top Topics

Top Venues

Publications

Xin Huang, Valeriy Sukharev, Taeyoung Kim, Sheldon X.-D. Tan
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing. Integr. 58 (2017)
Xin Huang, Valeriy Sukharev, Jun-Ho Choy, Marko Chew, Taeyoung Kim, Sheldon X.-D. Tan
Electromigration assessment for power grid networks considering temperature and thermal stress effects. Integr. 55 (2016)
Kai He, Xin Huang, Sheldon X.-D. Tan
EM-Based On-Chip Aging Sensor for Detection of Recycled ICs. IEEE Des. Test 33 (5) (2016)
Xin Huang, Valeriy Sukharev, Zhongdong Qi, Taeyoung Kim, Sheldon X.-D. Tan
Physics-based full-chip TDDB assessment for BEOL interconnects. DAC (2016)
Taeyoung Kim, Xin Huang, Hai-Bao Chen, Valeriy Sukharev, Sheldon X.-D. Tan
Learning-based dynamic reliability management for dark silicon processor considering EM effects. DATE (2016)
Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan
Voltage-based electromigration immortality check for general multi-branch interconnects. ICCAD (2016)
Xin Huang, Valeriy Sukharev, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing. ASP-DAC (2016)
Xin Huang, Armen Kteyan, Sheldon X.-D. Tan, Valeriy Sukharev
Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35 (11) (2016)
Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Taeyoung Kim, Valeriy Sukharev
Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35 (11) (2016)
Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Valeriy Sukharev
New electromigration modeling and analysis considering time-varying temperature and current densities. ASP-DAC (2015)
Hai-Bao Chen, Ying-Chi Li, Sheldon X.-D. Tan, Xin Huang, Hai Wang, Ngai Wong
-Matrix-Based Finite-Element-Based Thermal Analysis for 3D ICs. ACM Trans. Design Autom. Electr. Syst. 20 (4) (2015)
Kai He, Xin Huang, Sheldon X.-D. Tan
EM-Based on-Chip Aging Sensor for Detection and Prevention of Counterfeit and Recycled ICs. ICCAD (2015)
Zao Liu, Sheldon X.-D. Tan, Xin Huang, Hai Wang
Task Migrations for Distributed Thermal Management Considering Transient Effects. IEEE Trans. Very Large Scale Integr. Syst. 23 (2) (2015)
Hai-Bao Chen, Sheldon X.-D. Tan, Valeriy Sukharev, Xin Huang, Taeyoung Kim
Interconnect reliability modeling and analysis for multi-branch interconnect trees. DAC (2015)
Hai-Bao Chen, Sheldon X.-D. Tan, David H. Shin, Xin Huang, Hai Wang, Guoyong Shi
-matrix-based finite element linear solver for fast transient thermal analysis of high-performance ICs. Int. J. Circuit Theory Appl. 43 (12) (2015)
Xin Huang, Tan Yu, Valeriy Sukharev, Sheldon X.-D. Tan
Physics-based Electromigration Assessment for Power Grid Networks. DAC (2014)
Marko Chew, Ara Aslyan, Jun-Ho Choy, Xin Huang
Accurate full-chip estimation of power map, current densities and temperature for EM assessment. ICCAD (2014)
Ying-Chi Li, Sheldon X.-D. Tan, Tan Yu, Xin Huang, Ngai Wong
Direct finite-element-based solver for 3D-IC thermal analysis via H-matrix representation. ISQED (2014)
Valeriy Sukharev, Xin Huang, Hai-Bao Chen, Sheldon X.-D. Tan
IR-drop based electromigration assessment: parametric failure chip-scale analysis. ICCAD (2014)
Zao Liu, Xin Huang, Sheldon X.-D. Tan, Hai Wang, He Tang
Distributed task migration for thermal hot spot reduction in many-core microprocessors. ASICON (2013)