Ehrenfried Zschech

Publication Activity (10 Years)

Years Active: 2012-2021
Publications (10 Years): 6

Top Topics

Unscented Kalman Filter

Software Reliability

Top Venues

Microelectron. Reliab.

J. Electron. Test.

Publications

Zhenjun Zhang, Matthias Kraatz, Meike Hauschildt, Seungman Choi, André Clausner, Ehrenfried Zschech, Martin Gall
Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects. IRPS (2021)
Simon Schlipf, André Clausner, Jens Paul, Simone Capecchi, Laura Wambera, Karsten Meier, Ehrenfried Zschech
Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor. IRPS (2020)
André Clausner, Simon Schlipf, Gottfried Kurz, Michael Otto, Jens Paul, Kay-Uwe Giering, Jens Warmuth, André Lange, Roland Jancke, Andreas Aal, Rüdiger Rosenkranz, Martin Gall, Ehrenfried Zschech
Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation. IRPS (2018)
Jens Warmuth, Kay-Uwe Giering, André Lange, André Clausner, Simon Schlipf, Gottfried Kurz, Michael Otto, Jens Paul, Roland Jancke, Andreas Aal, Martin Gall, Ehrenfried Zschech
Prediction of SRAM Reliability Under Mechanical Stress Induced by Harsh En§ironments. ESSDERC (2018)
M. Kraatz, Christoph Sander, André Clausner, M. Hauschildt, Yvonne Standke, Martin Gall, Ehrenfried Zschech
Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling. IRPS (2018)
Jin Huang, Markus Löffler, W. Moeller, Ehrenfried Zschech
Ga contamination in silicon by Focused Ion Beam milling: Dynamic model simulation and Atom Probe Tomography experiment. Microelectron. Reliab. 64 (2016)
Christoph Sander, Yvonne Standke, Sven Niese, Rüdiger Rosenkranz, André Clausner, Martin Gall, Ehrenfried Zschech
Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration. Microelectron. Reliab. 54 (9-10) (2014)
Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy, Henrik Hovsepyan, Ara Markosian, Ehrenfried Zschech, Rene Huebner
Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance. J. Electron. Test. 28 (1) (2012)