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Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance.

Valeriy SukharevArmen KteyanJun-Ho ChoyHenrik HovsepyanAra MarkosianEhrenfried ZschechRene Huebner
Published in: J. Electron. Test. (2012)
Keyphrases
  • multiscale
  • discrete event simulation
  • data mining
  • simulation study
  • simulation environment
  • scale space
  • multiple scales
  • feature extraction
  • multi class
  • image representation
  • data acquisition
  • coarse to fine