Login / Signup
André Clausner
ORCID
Publication Activity (10 Years)
Years Active: 2014-2021
Publications (10 Years): 5
Top Topics
Computer Based Instruction
Knn
Stability Analysis
Lower Cost
Top Venues
IRPS
Microelectron. Reliab.
ESSDERC
</>
Publications
</>
Zhenjun Zhang
,
Matthias Kraatz
,
Meike Hauschildt
,
Seungman Choi
,
André Clausner
,
Ehrenfried Zschech
,
Martin Gall
Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects.
IRPS
(2021)
Simon Schlipf
,
André Clausner
,
Jens Paul
,
Simone Capecchi
,
Laura Wambera
,
Karsten Meier
,
Ehrenfried Zschech
Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor.
IRPS
(2020)
André Clausner
,
Simon Schlipf
,
Gottfried Kurz
,
Michael Otto
,
Jens Paul
,
Kay-Uwe Giering
,
Jens Warmuth
,
André Lange
,
Roland Jancke
,
Andreas Aal
,
Rüdiger Rosenkranz
,
Martin Gall
,
Ehrenfried Zschech
Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation.
IRPS
(2018)
Jens Warmuth
,
Kay-Uwe Giering
,
André Lange
,
André Clausner
,
Simon Schlipf
,
Gottfried Kurz
,
Michael Otto
,
Jens Paul
,
Roland Jancke
,
Andreas Aal
,
Martin Gall
,
Ehrenfried Zschech
Prediction of SRAM Reliability Under Mechanical Stress Induced by Harsh En§ironments.
ESSDERC
(2018)
M. Kraatz
,
Christoph Sander
,
André Clausner
,
M. Hauschildt
,
Yvonne Standke
,
Martin Gall
,
Ehrenfried Zschech
Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling.
IRPS
(2018)
Christoph Sander
,
Yvonne Standke
,
Sven Niese
,
Rüdiger Rosenkranz
,
André Clausner
,
Martin Gall
,
Ehrenfried Zschech
Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration.
Microelectron. Reliab.
54 (9-10) (2014)