Seungman Choi

Publication Activity (10 Years)

Years Active: 2015-2024
Publications (10 Years): 10

Top Topics

Rapid Development

Silicon Dioxide

Heuristic Evaluation

Top Venues

Int. J. Autom. Technol.

Publications

Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, J. Shuster-Passage, Seungman Choi, M. Gall
A Unified Physics-Based Stochastic Model for EM-Induced Resistance Degradation in BEoL Interconnect Segments. IRPS (2024)
J. Shuster-Passage, S. Abdel Razek, M. Mattoo, Meike Hauschildt, Seungman Choi, Martin Gall, Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Matthias Kraatz, J. R. Lloyd
A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. IRPS (2024)
Zhuo-Jie Wu, Ping-Chuan Wang, Seungman Choi, Patrick Justison, Martin Gall, Jae Kyu Cho, Takako Hirokawa, Yusheng Bian, Thomas Houghton, Vaishnavi Karra, Dan Moy, Karen Nummy, Dave Riggs, Norman Robson, Ian Melville, Ken Giewont
Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal. OFC (2023)
Brian T. McGowan, Michal Rakowski, Seungman Choi
Nickel Silicide Electromigration on Micro Ring Modulators for Silicon Photonics Technology. IRPS (2023)
Yuki Taoka, Kohei Kawabata, Pasomphone Hemthavy, Seungman Choi, Kunio Takahashi, Shigeki Saito
Development of Bipolar Electrostatic Chuck with a Beam-Array Assembly Fabricated by Lithography. Int. J. Autom. Technol. 16 (4) (2022)
Zhenjun Zhang, Matthias Kraatz, Meike Hauschildt, Seungman Choi, André Clausner, Ehrenfried Zschech, Martin Gall
Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects. IRPS (2021)
Beom Young Jeong, Seungman Choi, Kyudong Park
Heuristic Evaluation for Augmentative and Alternative Communication Application: A Case Study. ICTC (2021)
Lili Cheng, Seungman Choi, Sean P. Ogden, Teck Jung Tang, Robert Fox
Robust BEOL MIMCAP for Long and Controllable TDDB Lifetime. IRPS (2019)
Seungman Choi, Cathryn Christiansen, Linjun Cao, James Zhang, Ronald Filippi, Tian Shen, Kong Boon Yeap, Sean P. Ogden, Haojun Zhang, Bianzhu Fu, Patrick Justison
Effect of metal line width on electromigration of BEOL Cu interconnects. IRPS (2018)
C. S. Premachandran, Seungman Choi, Salvatore Cimino, Thuy Tran-Quinn, Lloyd Burrell, Patrick Justison
Reliability challenges for 2.5D/3D integration: An overview. IRPS (2018)
Kong Boon Yeap, Tian Shen, Galor Wenyi Zhang, Sing Fui Yap, Brian Holt, Arfa Gondal, Seungman Choi, San Leong Liew, Walter Yao, Patrick Justison
Impact of electrode surface modulation on time-dependent dielectric breakdown. IRPS (2015)