An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems.

Valeriy Sukharev Armen Kteyan Jun-Ho Choy

Published in: 3DIC (2019)

Keyphrases

distributed systems
building blocks
low cost
key technologies
support systems
database
real time
neural network
expert systems
management system
highly accurate
computing systems
programmable logic