Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance.
Armen KteyanJun-Ho ChoyValeriy SukharevMassimo BertolettiCarmelo MaiorcaRossana ZadraMassimo InzaghiGabriele GattereGiancarlo ZincoPaolo ValenteRoberto BardelliAlessandro ValerioPierluigi RolandiMattia MonettiValentina CuomoSalvatore SantapaPublished in: ISPD (2022)