C. Ferrandon

Publication Activity (10 Years)

Years Active: 2013-2013
Publications (10 Years): 0

Top Topics

Semiconductor Manufacturing

Top Venues

Publications

Y. Lamy, Laurent Dussopt, Ossama El Bouayadi, C. Ferrandon, Alexandre Siligaris, Cedric Dehos, Pierre Vincent
A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications. 3DIC (2013)
Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. 3DIC (2013)