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A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications.

Y. LamyLaurent DussoptOssama El BouayadiC. FerrandonAlexandre SiligarisCedric DehosPierre Vincent
Published in: 3DIC (2013)
Keyphrases
  • high speed
  • wireless communication
  • frequency band
  • dual band
  • wireless networks
  • wireless communication systems
  • low cost
  • mobile communication
  • steady state
  • wireless sensor networks
  • resonant frequency