Which interconnects for which 3D applications? Status and perspectives.

Y. Lamy J.-P. Colonna G. Simon Patrick Leduc Séverine Cheramy C. Laviron

Published in: 3DIC (2013)

Keyphrases

input output
neural network
lower cost
power dissipation
current issues
fiber optic
genetic algorithm
decision making
learning environment
pairwise
multiresolution
hidden markov models
multiple perspectives