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Ren-Jie Lee
Publication Activity (10 Years)
Years Active: 2007-2013
Publications (10 Years): 0
Top Topics
High Density
Programmable Logic
Planning Problems
Mixed Initiative
Top Venues
ACM Trans. Design Autom. Electr. Syst.
IEEE Trans. Very Large Scale Integr. Syst.
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Publications
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Ren-Jie Lee
,
Hsin-Wu Hsu
,
Hung-Ming Chen
Board- and Chip-Aware Package Wire Planning.
IEEE Trans. Very Large Scale Integr. Syst.
21 (8) (2013)
Ren-Jie Lee
,
Hung-Ming Chen
A study of row-based area-array I/O design planning in concurrent chip-package design flow.
ACM Trans. Design Autom. Electr. Syst.
18 (2) (2013)
Ren-Jie Lee
,
Hung-Ming Chen
Row-based area-array I/O design planning in concurrent chip-package design flow.
ASP-DAC
(2011)
Tsung-Ying Tsai
,
Ren-Jie Lee
,
Ching-Yu Chin
,
Chung-Yi Kuan
,
Hung-Ming Chen
,
Yoji Kajitani
On routing fixed escaped boundary pins for high speed boards.
DATE
(2011)
Ren-Jie Lee
,
Hung-Ming Chen
Efficient Package Pin-Out Planning With System Interconnects Optimization for Package-Board Codesign.
IEEE Trans. Very Large Scale Integr. Syst.
19 (5) (2011)
Ren-Jie Lee
,
Hung-Ming Chen
Fast Flip-Chip Pin-Out Designation Respin for Package-Board Codesign.
IEEE Trans. Very Large Scale Integr. Syst.
17 (8) (2009)
Ren-Jie Lee
,
Ming-Fang Lai
,
Hung-Ming Chen
Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign.
ASP-DAC
(2007)