Fast Flip-Chip Pin-Out Designation Respin for Package-Board Codesign.

Ren-Jie Lee Hung-Ming Chen

Published in: IEEE Trans. Very Large Scale Integr. Syst. (2009)

Keyphrases

high speed
low cost
high density
analog vlsi
hardware software
single chip
vlsi implementation
board game
host computer
solid models
hw sw
programmable logic
circuit design
information systems
physical design
software package
hardware and software
functional verification
multichip module