Rao R. Tummala

Publication Activity (10 Years)

Years Active: 1991-2018
Publications (10 Years): 2

Top Topics

Distribution Network

Radio Frequency

Benchmark Datasets

Statistical Analysis

Top Venues

Microelectron. J.

Microelectron. Reliab.

Publications

Min Suk Kim, Markondeya Raj Pulugurtha, Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Vanessa Smet, Venky Sundaram, Joungho Kim, Rao R. Tummala
Miniaturized and high-performance RF packages with ultra-thin glass substrates. Microelectron. J. 77 (2018)
Markondeya Raj Pulugurtha, Himani Sharma, Srikrishna Sitaraman, Dibyajat Mishra, Rao R. Tummala
System Scaling With Nanostructured Power and RF Components. Proc. IEEE 105 (12) (2017)
Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. 3DIC (2014)
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. 3DIC (2013)
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. 3DIC (2013)
Xi Liu, Qiao Chen, Venkatesh Sundaram, Rao R. Tummala, Suresh K. Sitaraman
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test. Microelectron. Reliab. 53 (1) (2013)
Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, Rao R. Tummala
Electrical modeling of Through Silicon and Package Vias. 3DIC (2009)
Rao R. Tummala, Venky Sundaram, Ritwik Chatterjee, P. Markodeya Raj, Nitesh Kumbhat, Vijay Sukumaran, Vikay Sridharan, Abhishek Choudury, Qiao Chen, Tapobrata Bandyopadhyay
Trend from ICs to 3D ICs to 3D systems. CICC (2009)
Rao R. Tummala, Joy Laskar
Gigabit wireless: system-on-a-package technology. Proc. IEEE 92 (2) (2004)
Rao R. Tummala, Vijay K. Madisetti
System on Chip or System on Package? IEEE Des. Test Comput. 16 (2) (1999)
Rao R. Tummala
Multichip packaging-a tutorial. Proc. IEEE 80 (12) (1992)
Rao R. Tummala, John U. Knickerbocker, Sarah H. Knickerbocker, L. Wynn Herron, Robert W. Nufer, Raj N. Master, Mark O. Neisser, Benedikt M. Kellner, Charles H. Perry, James N. Humenik, Thomas F. Redmond
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution. IBM J. Res. Dev. 36 (5) (1992)
Arnold E. Barish, James P. Eckhardt, Mark D. Mayo, Walter A. Svarczkopf, Santosh P. Gaur, Rao R. Tummala
Mainframe. ICCD (1991)