Suresh K. Sitaraman

Publication Activity (10 Years)

Years Active: 2007-2019
Publications (10 Years): 3

Top Topics

Schottky Barrier

Field Effect Transistors

Statistical Analysis

Top Venues

Microelectron. Reliab.

IEEE Internet Things J.

Publications

Nitish Kumar, Jialuo Chen, Monodeep Kar, Suresh K. Sitaraman, Saibal Mukhopadhyay, Satish Kumar
Multigated Carbon Nanotube Field Effect Transistors-Based Physically Unclonable Functions As Security Keys. IEEE Internet Things J. 6 (1) (2019)
Philip Y. Chung, Suresh K. Sitaraman
Random vibration analysis of 3-Arc-Fan compliant interconnects. Microelectron. Reliab. 81 (2018)
Jun-Yang Lei, Thomas Moon, Justin Chow, Suresh K. Sitaraman, Abhijit Chatterjee
A Monobit Built-In Test and Diagnostic System for Flexible Electronic Interconnect. ATS (2018)
Ye Tian, Xi Liu, Justin Chow, Yi-Ping Wu, Suresh K. Sitaraman
Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies. Microelectron. Reliab. 54 (5) (2014)
Wei Chen, Raphael Okereke, Suresh K. Sitaraman
Compliance analysis of multi-path fan-shaped interconnects. Microelectron. Reliab. 53 (7) (2013)
Xi Liu, Qiao Chen, Venkatesh Sundaram, Rao R. Tummala, Suresh K. Sitaraman
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test. Microelectron. Reliab. 53 (1) (2013)
Moongon Jung, Xi Liu, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim
Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC. ICCAD (2011)
Injoong Kim, Russell S. Peak, Suresh K. Sitaraman
ROM: a reliability knowledge representation for collaborative system design. Eng. Comput. 26 (1) (2010)
Krishna Tunga, Suresh K. Sitaraman
Laser moiré interferometry for fatigue life prediction of lead-free solders. Microelectron. Reliab. 50 (12) (2010)
Sai Zeng, Russell S. Peak, Angran Xiao, Suresh K. Sitaraman
ZAP: a knowledge-based FEA modeling method for highly coupled variable topology multi-body problems. Eng. Comput. 24 (4) (2008)
Andy Perkins, Suresh K. Sitaraman
Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages. Microelectron. Reliab. 47 (12) (2007)