Moongon Jung

Publication Activity (10 Years)

Years Active: 2010-2017
Publications (10 Years): 2

Top Topics

Reliability Analysis

Processing Elements

Top Venues

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

Publications

Moongon Jung, Taigon Song, Yarui Peng, Sung Kyu Lim
Design Methodologies for Low-Power 3-D ICs With Advanced Tier Partitioning. IEEE Trans. Very Large Scale Integr. Syst. 25 (7) (2017)
Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory). IEEE Trans. Computers 64 (1) (2015)
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. Commun. ACM 57 (1) (2014)
Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim
On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective. DAC (2014)
Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, Sung Kyu Lim
Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs. ASP-DAC (2013)
Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim
How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core. CICC (2013)
Chun Zhang, Moongon Jung, Sung Kyu Lim, Yiyu Shi
Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives. ICCAD (2013)
Moongon Jung, David Z. Pan, Sung Kyu Lim
Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32 (11) (2013)
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim
TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31 (8) (2012)
Moongon Jung, David Z. Pan, Sung Kyu Lim
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs. DAC (2012)
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang
Design for manufacturability and reliability for TSV-based 3D ICs. ASP-DAC (2012)
Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
3D-MAPS: 3D Massively parallel processor with stacked memory. ISSCC (2012)
Moongon Jung, Xi Liu, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim
Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC. ICCAD (2011)
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. DAC (2011)
Moongon Jung, Sung Kyu Lim
A study of IR-drop noise issues in 3D ICs with through-silicon-vias. 3DIC (2010)
Michael B. Healy, Krit Athikulwongse, Rohan Goel, Mohammad M. Hossain, Dae Hyun Kim, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Moongon Jung, Brian Ouellette, Mohit Pathak, Hemant Sane, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory. CICC (2010)