Joungho Kim

Publication Activity (10 Years)

Years Active: 2005-2023
Publications (10 Years): 16

Top Topics

Integrated Circuit

Electromagnetic Fields

Distribution Network

Top Venues

IEEE Trans. Ind. Electron.

Publications

Jiwon Yoon, Hyunwoo Kim, Boogyo Sim, Hyunwook Park, Yi-Gyeong Kim, Sujin Park, Youngsu Kwon, Joungho Kim
Multi-Stripline Redistribution Layer Interposer Channel Design for High Bandwidth Memory Module Considering Via Interconnect. ISOCC (2023)
Federico Berto, Chuanbo Hua, Junyoung Park, Minsu Kim, Hyeonah Kim, Jiwoo Son, Haeyeon Kim, Joungho Kim, Jinkyoo Park
RL4CO: an Extensive Reinforcement Learning for Combinatorial Optimization Benchmark. CoRR (2023)
Haeyeon Kim, Minsu Kim, Federico Berto, Joungho Kim, Jinkyoo Park
DevFormer: A Symmetric Transformer for Context-Aware Device Placement. ICML (2023)
Haeyeon Kim, Minsu Kim, Joungho Kim, Jinkyoo Park
Collaborative Distillation Meta Learning for Simulation Intensive Hardware Design. CoRR (2022)
HyunWook Park, Minsu Kim, Seongguk Kim, Keunwoo Kim, Haeyeon Kim, Taein Shin, Keeyoung Son, Boogyo Sim, Subin Kim, Seungtaek Jeong, Chulsoon Hwang, Joungho Kim
Transformer Network-based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM). CoRR (2022)
Minsu Kim, Jinkyoo Park, Joungho Kim
Learning Collaborative Policies to Solve NP-hard Routing Problems. NeurIPS (2021)
Minsu Kim, Jinkyoo Park, Joungho Kim
Learning Collaborative Policies to Solve NP-hard Routing Problems. CoRR (2021)
Seongsoo Lee, Donghyun Kim, Yeonje Cho, Hongseok Kim, Chiuk Song, Seungtaek Jeong, Jinwook Song, Gyeyoung Park, Seokwoo Hong, Junyong Park, Kyungjun Cho, Hyunsuk Lee, Chulhun Seo, Seungyoung Ahn, Joungho Kim
Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System. IEEE Trans. Ind. Electron. 66 (6) (2019)
Seungtaek Jeong, Donghyun Kim, Jinwook Song, Hongseok Kim, Seongsoo Lee, Chiuk Song, Jaehak Lee, Junyeop Song, Joungho Kim
Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material. IEEE Trans. Ind. Electron. 66 (5) (2019)
Min-Woo Kim, Ji H. Kim, Yeonje Cho, Minsik Kim, Bo H. Choi, Kwyro Lee, Joungho Kim, Gyu-Hyeong Cho, Chun T. Rim
High-Resolution Synthesized Magnetic Field Focusing for RF Barcode Applications. IEEE Trans. Ind. Electron. 65 (1) (2018)
Min Suk Kim, Markondeya Raj Pulugurtha, Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Vanessa Smet, Venky Sundaram, Joungho Kim, Rao R. Tummala
Miniaturized and high-performance RF packages with ultra-thin glass substrates. Microelectron. J. 77 (2018)
Yeseul Jeon, Heegon Kim, Joungho Kim, Minkyu Je
Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s. IEEE Trans. Circuits Syst. I Regul. Pap. (7) (2018)
Chiuk Song, Hongseok Kim, Youngwoo Kim, Donghyun Kim, Seungtaek Jeong, Yeonje Cho, Seongsoo Lee, Seungyoung Ahn, Joungho Kim
EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field. IEEE Trans. Ind. Electron. 65 (9) (2018)
Sung Joo Park, Bumhee Bae, Joungho Kim, Madhavan Swaminathan
Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems. IEEE Trans. Very Large Scale Integr. Syst. 25 (6) (2017)
Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Des. Test 33 (2) (2016)
Subin Kim, Youngwoo Kim, Kyungjun Cho, Jinwook Song, Joungho Kim
Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC. 3DIC (2016)
Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. EMC Compo (2015)
Hyunsuk Lee, Kyungjun Cho, Heegon Kim, Sumin Choi, Jaemin Lim, Joungho Kim
Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module. 3DIC (2015)
Insu Hwang, Jihye Kim, Youngwoo Kim, Jonghyun Cho, Joungho Kim
Noise coupling modeling and analysis of through glass via(TGV). 3DIC (2015)
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation. 3DIC (2015)
Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. 3DIC (2015)
Joungho Kim
Active Si interposer for 3D IC integrations. 3DIC (2015)
Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo (2015)
Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory). IEEE Trans. Computers 64 (1) (2015)
Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 3DIC (2014)
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Fault detection and isolation of multiple defects in through silicon via (TSV) channel. 3DIC (2014)
Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. 3DIC (2014)
Yangbae Chun, Seongwook Park, Jonghoon J. Kim, Jiseong Kim, Hongseok Kim, Joungho Kim, Nam Kim, Seungyoung Ahn
Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System. IEICE Trans. Commun. (2) (2014)
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. 3DIC (2013)
Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Fault isolation of short defect in through silicon via (TSV) based 3D-IC. 3DIC (2013)
Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. EMC Compo (2013)
Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
Eye-diagram simulation and analysis of a high-speed TSV-based channel. 3DIC (2013)
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. 3DIC (2013)
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Modeling and analysis of open defect in through silicon via (TSV) channel. EMC Compo (2013)
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. 3DIC (2013)
Joohee Kim, Joungho Kim
Signal integrity modeling and measurement of TSV in 3D IC. ASP-DAC (2013)
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. EMC Compo (2013)
Bumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, Joungho Kim
Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment. EMC Compo (2013)
Jiseong Kim, Jonghoon J. Kim, Sunkyu Kong, Hongseok Kim, In-Soo Suh, Nam Pyo Suh, Dong-Ho Cho, Joungho Kim, Seungyoung Ahn
Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System. Proc. IEEE 101 (6) (2013)
Jonghyun Cho, Joungho Kim
Signal integrity design of TSV and interposer in 3D-IC. LASCAS (2013)
Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
3D-MAPS: 3D Massively parallel processor with stacked memory. ISSCC (2012)
Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. ISQED (2011)
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC. DAC (2011)
Jiseong Kim, Eakhwan Song, Jeonghyeon Cho, Yujeong Shim, Gawon Kim, Joungho Kim
Frequency-Dependent Transmission Line Model of a Stranded Coaxial Cable. IEICE Trans. Electron. (1) (2010)
Chaeho Chung, Soobum Lee, Byung Man Kwak, Gawon Kim, Joungho Kim
A Delay Line Circuit Design for Crosstalk Minimization Using Genetic Algorithm. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 27 (3) (2008)
Changwook Yoon, Junwoo Lee, Young-Jin Park, Hyunjeong Park, Jaemin Kim, Junso Pak, Joungho Kim
Design of a Low-Noise UWB Transceiver SiP. IEEE Des. Test Comput. 25 (1) (2008)
Hyunjeong Park, Hyungsoo Kim, Junso Pak, Changwook Yoon, Kyoungchoul Koo, Joungho Kim
Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network. IEICE Trans. Electron. (4) (2008)
Junso Pak, Masahiro Aoyagi, Katsuya Kikuchi, Joungho Kim
Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB. IEICE Trans. Electron. (4) (2006)
Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee
Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array. IEEE Des. Test Comput. 23 (3) (2006)
Daehyun Chung, Chunghyun Ryu, Hyungsoo Kim, Choonheung Lee, Jinhan Kim, Kicheol Bae, Jiheon Yu, Hoi-Jun Yoo, Joungho Kim
Chip-package hybrid clock distribution network and DLL for low jitter clock delivery. IEEE J. Solid State Circuits 41 (1) (2006)
Seungyong Baek, Jingook Kim, Joungho Kim
Modeling and Measurement of Mode-Conversion and Frequency Dependent Loss in High-Speed Differential Interconnections on Multilayer PCB. IEICE Trans. Electron. (10) (2005)
Joungho Kim, Junso Pak, Jongbae Park, Hyungsoo Kim
Noise generation, coupling, isolation, and EM radiation in high-speed package and PCB. ISCAS (6) (2005)