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TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.

Jonghoon J. KimDaniel H. JungHeegon KimSunkyu KongSumin ChoiJaemin LimJoungho Kim
Published in: EMC Compo (2015)
Keyphrases
  • real world
  • integrated circuit
  • wide range
  • real time
  • information retrieval
  • objective function
  • multi agent
  • hidden markov models