Sunkyu Kong

Publication Activity (10 Years)

Years Active: 2013-2015
Publications (10 Years): 1

Top Topics

Design Methodology

Levels Of Abstraction

Top Venues

Publications

Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo (2015)
Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 3DIC (2014)
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. 3DIC (2013)
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. EMC Compo (2013)
Bumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, Joungho Kim
Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment. EMC Compo (2013)
Jiseong Kim, Jonghoon J. Kim, Sunkyu Kong, Hongseok Kim, In-Soo Suh, Nam Pyo Suh, Dong-Ho Cho, Joungho Kim, Seungyoung Ahn
Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System. Proc. IEEE 101 (6) (2013)