Jaemin Lim

Publication Activity (10 Years)

Years Active: 2015-2024
Publications (10 Years): 6

Top Topics

Location Privacy

Audio Recordings

Gallium Arsenide

Top Venues

Publications

Jaemin Lim, Kiyeon Kim
Wav2vec-VC: Voice Conversion via Hidden Representations of Wav2vec 2.0. ICASSP (2024)
Jaemin Lim, Kiyeon Kim, Hyunwoo Yu, Suk-Bok Lee
Overo: Sharing Private Audio Recordings. CCS (2022)
Jaemin Lim, Kiyeon Kim, Hyunwoo Yu, Suk-Bok Lee
Making Connected Cars Untraceable via DSRC Radios. IEEE Access 8 (2020)
Hyunwoo Yu, Jaemin Lim, Kiyeon Kim, Suk-Bok Lee
Pinto: Enabling Video Privacy for Commodity IoT Cameras. CCS (2018)
Minho Kim, Jaemin Lim, Hyunwoo Yu, Kiyeon Kim, Younghoon Kim, Suk-Bok Lee
ViewMap: Sharing Private In-Vehicle Dashcam Videos. NSDI (2017)
Jaemin Lim, Hyunwoo Yu, Kiyeon Kim, Minho Kim, Suk-Bok Lee
Preserving Location Privacy of Connected Vehicles With Highly Accurate Location Updates. IEEE Commun. Lett. 21 (3) (2017)
Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. EMC Compo (2015)
Hyunsuk Lee, Kyungjun Cho, Heegon Kim, Sumin Choi, Jaemin Lim, Joungho Kim
Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module. 3DIC (2015)
Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. 3DIC (2015)
Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo (2015)