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Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC.
Jaemin Lim
Manho Lee
Daniel H. Jung
Jonghoon J. Kim
Sumin Choi
Hyunsuk Lee
Joungho Kim
Published in:
EMC Compo (2015)
Keyphrases
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field effect transistors
high speed
image structure
semiconductor devices
gallium arsenide
noise level
low cost
noisy data
noise reduction
missing data
integrated circuit
high density
image noise
markov chain
steady state
delay insensitive