Daniel H. Jung

Publication Activity (10 Years)

Years Active: 2013-2016
Publications (10 Years): 1

Top Topics

Fault Isolation

High Speed Camera

Gallium Arsenide

Top Venues

Publications

Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Des. Test 33 (2) (2016)
Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. EMC Compo (2015)
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation. 3DIC (2015)
Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. 3DIC (2015)
Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo (2015)
Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 3DIC (2014)
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Fault detection and isolation of multiple defects in through silicon via (TSV) channel. 3DIC (2014)
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. 3DIC (2013)
Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Fault isolation of short defect in through silicon via (TSV) based 3D-IC. 3DIC (2013)
Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. EMC Compo (2013)
Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
Eye-diagram simulation and analysis of a high-speed TSV-based channel. 3DIC (2013)
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Modeling and analysis of open defect in through silicon via (TSV) channel. EMC Compo (2013)
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. EMC Compo (2013)