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Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

Jonghoon J. KimHeegon KimSukjin KimBumhee BaeDaniel H. JungSunkyu KongJoungho KimJunho LeeKunwoo Park
Published in: EMC Compo (2013)
Keyphrases
  • case study
  • knowledge based systems
  • levels of abstraction
  • design process
  • structural information
  • real time
  • information retrieval
  • user interface
  • test cases
  • design methodology