Bumhee Bae

Publication Activity (10 Years)

Years Active: 2013-2019
Publications (10 Years): 2

Top Topics

Design Methodology

Integrated Circuit

Semiconductor Manufacturing

Top Venues

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Bumhee Bae, Younho Kim, Minseok Kim, Youngkun Kwon, Jeongnam Cheon
Proposal of Flat-coaxial Cable Structure and its Design Methodology based on FPCB process for 5G application. ICCE (2019)
Sung Joo Park, Bumhee Bae, Joungho Kim, Madhavan Swaminathan
Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems. IEEE Trans. Very Large Scale Integr. Syst. 25 (6) (2017)
Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 3DIC (2014)
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. 3DIC (2013)
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. EMC Compo (2013)
Bumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, Joungho Kim
Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment. EMC Compo (2013)