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Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.
Jonghoon J. Kim
Heegon Kim
Sukjin Kim
Bumhee Bae
Daniel H. Jung
Sunkyu Kong
Joungho Kim
Junho Lee
Kunwoo Park
Published in:
3DIC (2013)
Keyphrases
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test cases
similarity measure
database
computer vision
integrated circuit
levels of abstraction
data sets
neural network
artificial intelligence
decision trees
fine grained
test data
statistical tests
magnetic field
design methodology
semiconductor manufacturing