Kwang-Seong Choi

Publication Activity (10 Years)

Years Active: 2007-2019
Publications (10 Years): 3

Top Topics

Fault Isolation

Material Properties

Spatially Varying

Top Venues

Microelectron. Reliab.

Publications

Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration. 3DIC (2019)
Hyungseok Yoon, Kwang-Seong Choi, Hyun-Cheol Bae, Jong-Tae Moon, Yong-Sung Eom, Insu Jeon
Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis. Microelectron. Reliab. 71 (2017)
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation. 3DIC (2015)
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Fault detection and isolation of multiple defects in through silicon via (TSV) channel. 3DIC (2014)
Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Fault isolation of short defect in through silicon via (TSV) based 3D-IC. 3DIC (2013)
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Modeling and analysis of open defect in through silicon via (TSV) channel. EMC Compo (2013)
Jeha Kim, Yong-Duck Chung, Kwang-Seong Choi, Young-Shik Kang, Kyoung-Ik Cho
Characteristics of 60 GHz Analog RF-Optic Transceiver Module. IEICE Trans. Electron. (2) (2007)