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Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis.
Hyungseok Yoon
Kwang-Seong Choi
Hyun-Cheol Bae
Jong-Tae Moon
Yong-Sung Eom
Insu Jeon
Published in:
Microelectron. Reliab. (2017)
Keyphrases
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numerical analysis
material properties
finite element
image enhancement
spatially varying
finite element analysis
soft tissue
finite element model
theoretical analysis
motion analysis
computer vision
motion tracking