Yong-Sung Eom

Publication Activity (10 Years)

Years Active: 2017-2019
Publications (10 Years): 2

Top Topics

Data Compression

Material Properties

Spatially Varying

Numerical Analysis

Top Venues

Microelectron. Reliab.

Publications

Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration. 3DIC (2019)
Hyungseok Yoon, Kwang-Seong Choi, Hyun-Cheol Bae, Jong-Tae Moon, Yong-Sung Eom, Insu Jeon
Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis. Microelectron. Reliab. 71 (2017)