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Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration.

Kwang-Seong ChoiYong-Sung EomSeok Hwan MoonJiho JooKwangjoo LeeJung Hak KimJu Hyeon Kim
Published in: 3DIC (2019)
Keyphrases
  • development process
  • process model
  • real time
  • software engineering
  • information retrieval
  • image processing
  • image sequences
  • image compression
  • data compression