Jonghyun Cho

Publication Activity (10 Years)

Years Active: 2011-2017
Publications (10 Years): 4

Top Topics

Fault Isolation

Distribution Network

Mathematical Analysis

Top Venues

J. Inform. and Commun. Convergence Engineering

IEEE Trans. Instrum. Meas.

Publications

Jonghyun Cho, Myunghoi Kim
Electromagnetic Interference Analysis of an Inhomogeneous Electromagnetic Bandgap Power Bus for High-Speed Circuits. J. Inform. and Commun. Convergence Engineering 15 (4) (2017)
Francesco de Paulis, Stefano Piersanti, Qian Wang, Jonghyun Cho, Nicholas Erickson, Brice Achkir, Jun Fan, James L. Drewniak, Antonio Orlandi
TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization. IEEE Trans. Instrum. Meas. 66 (4) (2017)
Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Des. Test 33 (2) (2016)
Jonghyun Cho, Myunghoi Kim
Suppression of Parallel Plate Modes Using Edge-Located EBG Structure in High-Speed Power Bus. J. Inform. and Commun. Convergence Engineering 14 (4) (2016)
Insu Hwang, Jihye Kim, Youngwoo Kim, Jonghyun Cho, Joungho Kim
Noise coupling modeling and analysis of through glass via(TGV). 3DIC (2015)
Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. 3DIC (2014)
Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
Fault isolation of short defect in through silicon via (TSV) based 3D-IC. 3DIC (2013)
Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. EMC Compo (2013)
Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
Eye-diagram simulation and analysis of a high-speed TSV-based channel. 3DIC (2013)
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. 3DIC (2013)
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. 3DIC (2013)
Jonghyun Cho, Joungho Kim
Signal integrity design of TSV and interposer in 3D-IC. LASCAS (2013)
Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. ISQED (2011)
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC. DAC (2011)