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Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs.

Taigon SongChang LiuDae Hyun KimSung Kyu LimJonghyun ChoJoohee KimJunso PakSeungyoung AhnJoungho KimKihyun Yoon
Published in: ISQED (2011)
Keyphrases
  • image analysis
  • statistical analysis
  • computer vision
  • information systems
  • database systems
  • pattern recognition
  • lower bound
  • multiresolution
  • quantitative analysis
  • small size