Dae Hyun Kim

ORCID

Publication Activity (10 Years)

Years Active: 2006-2024
Publications (10 Years): 31

Top Venues

University of Bremen (PHD)

Education History

University of Bremen

PHD

Publications

Hyung-Kwon Ko, Hyeon Jeon, Gwanmo Park, Dae Hyun Kim, Nam Wook Kim, Juho Kim, Jinwook Seo
Natural Language Dataset Generation Framework for Visualizations Powered by Large Language Models. CHI (2024)
Jihyeong Hong, Yokyung Lee, Dae Hyun Kim, Daeun Choi, Yeo-Jin Yoon, Gyu-cheol Lee, Zucheul Lee, Juho Kim
A Context-Aware Onboarding Agent for Metaverse Powered by Large Language Models. Conference on Designing Interactive Systems (2024)
Dae Hyun Kim, Hyungyu Shin, Shakhnozakhon Yadgarova, Jinho Son, Hariharan Subramonyam, Juho Kim
AINeedsPlanner: AWorkbook to Support Effective Collaboration Between AI Experts and Clients. CoRR (2024)
Dae Hyun Kim, Hyungyu Shin, Shakhnozakhon Yadgarova, Jinho Son, Hariharan Subramonyam, Juho Kim
AINeedsPlanner: A Workbook to Support Effective Collaboration Between AI Experts and Clients. Conference on Designing Interactive Systems (2024)
Hyunwoo Kim, Khanh-Duy Le, Gionnieve Lim, Dae Hyun Kim, Yoo Jin Hong, Juho Kim
DataDive: Supporting Readers' Contextualization of Statistical Statements with Data Exploration. IUI (2024)
Sunghyon Kyeong, Dae Hyun Kim
Development of a flexible self-calculation scoring model to determine stroke occurrence. J. Big Data 10 (1) (2023)
Hyung-Kwon Ko, Hyeon Jeon, Gwanmo Park, Dae Hyun Kim, Nam Wook Kim, Juho Kim, Jinwook Seo
Natural Language Dataset Generation Framework for Visualizations Powered by Large Language Models. CoRR (2023)
John Laurentiev, Mufaddal Mahesri, Lily Bessette, Cassandra York, Heidi Zakoul, Su Been Lee, Dae Hyun Kim, Li Zhou, Joshua Lin
Evaluation of a Machine Learning Approach to Identify ADL Impairment in Clinical Notes of People with Dementia. AMIA (2022)
David Hanley, Augusto S. Dantas de Oliveira, Xiangyuan Zhang, Dae Hyun Kim, Yusheng Wei, Timothy Bretl
The Impact of Height on Indoor Positioning With Magnetic Fields. IEEE Trans. Instrum. Meas. 70 (2021)
Dae Hyun Kim, Vidya Setlur, Maneesh Agrawala
Towards Understanding How Readers Integrate Charts and Captions: A Case Study with Line Charts. CoRR (2021)
Dae Hyun Kim, Vidya Setlur, Maneesh Agrawala
Towards Understanding How Readers Integrate Charts and Captions: A Case Study with Line Charts. CHI (2021)
Aryan Deshwal, Syrine Belakaria, Janardhan Rao Doppa, Dae Hyun Kim
Bayesian Optimization over Permutation Spaces. CoRR (2021)
David Hanley, Augusto S. Dantas de Oliveira, Xiangyuan Zhang, Dae Hyun Kim, Yusheng Wei, Timothy Bretl
Erratum to "The Impact of Height on Indoor Positioning With Magnetic Fields". IEEE Trans. Instrum. Meas. 70 (2021)
Aqeeb Iqbal Arka, Biresh Kumar Joardar, Ryan Gary Kim, Dae Hyun Kim, Janardhan Rao Doppa, Partha Pratim Pande
HeM3D: Heterogeneous Manycore Architecture Based on Monolithic 3D Vertical Integration. ACM Trans. Design Autom. Electr. Syst. 26 (2) (2021)
Aqeeb Iqbal Arka, Biresh Kumar Joardar, Ryan Gary Kim, Dae Hyun Kim, Janardhan Rao Doppa, Partha Pratim Pande
HeM3D: Heterogeneous Manycore Architecture Based on Monolithic 3D Vertical Integration. CoRR (2020)
Shouvik Musavvir, Anwesha Chatterjee, Ryan Gary Kim, Dae Hyun Kim, Partha Pratim Pande
Inter-Tier Process-Variation-Aware Monolithic 3-D NoC Design Space Exploration. IEEE Trans. Very Large Scale Integr. Syst. 28 (3) (2020)
Shouvik Musavvir, Anwesha Chatterjee, Ryan Gary Kim, Dae Hyun Kim, Janardhan Rao Doppa, Partha Pratim Pande
Power, Performance, and Thermal Trade-offs in M3D-enabled Manycore Chips. DATE (2020)
Vidya Setlur, Enamul Hoque, Dae Hyun Kim, Angel X. Chang
Sneak Pique: Exploring Autocompletion as a Data Discovery Scaffold for Supporting Visual Analysis. UIST (2020)
Dae Hyun Kim, Enamul Hoque, Maneesh Agrawala
Answering Questions about Charts and Generating Visual Explanations. CHI (2020)
Sheng-En David Lin, Dae Hyun Kim
Routing Complexity Minimization of Monolithic Three-Dimensional Integrated Circuits. ISQED (2019)
Jihee Seo, Dae Hyun Kim
High-Throughput Multiplier Architectures Enabled by Intra-Unit Fast Forwarding. ARITH (2019)
Jihee Seo, Dae Hyun Kim
Dependency-Resolving Intra-Unit Pipeline Architecture for High-Throughput Multipliers. DATE (2019)
Shouvik Musavvir, Anwesha Chatterjee, Ryan Gary Kim, Dae Hyun Kim, Partha Pratim Pande
Inter-Tier Process Variation-Aware Monolithic 3D NoC Architectures. CoRR (2019)
Shantonu Das, Dae Hyun Kim
A Non-Slicing 3-D Floorplan Representation for Monolithic 3-D IC Design. ISQED (2019)
Sheng-En David Lin, Dae Hyun Kim
Construction of All Multilayer Monolithic Rectilinear Steiner Minimum Trees on the 3D Hanan Grid for Monolithic 3D IC Routing. ISPD (2019)
Sheng-En David Lin, Dae Hyun Kim
Construction of All Rectilinear Steiner Minimum Trees on the Hanan Grid. ISPD (2018)
Dae Hyun Kim, Taeyoung Kong, Seungbin Jeong
Finding Solutions to Generative Adversarial Privacy. CoRR (2018)
Dae Hyun Kim, Enamul Hoque, Juho Kim, Maneesh Agrawala
Facilitating Document Reading by Linking Text and Tables. UIST (2018)
Dongjin Lee, Sourav Das, Dae Hyun Kim, Janardhan Rao Doppa, Partha Pratim Pande
Design Space Exploration of 3D Network-on-Chip: A Sensitivity-based Optimization Approach. ACM J. Emerg. Technol. Comput. Syst. 14 (3) (2018)
Yiting Chen, Dae Hyun Kim
A legalization algorithm for multi-tier gate-level monolithic three-dimensional integrated circuits. ISQED (2017)
Sheng-En David Lin, Partha Pratim Pande, Dae Hyun Kim
Optimization of dynamic power consumption in multi-tier gate-level monolithic 3D ICs. ISQED (2016)
Dae Hyun Kim, Sung Kyu Lim
Physical Design and CAD Tools for 3-D Integrated Circuits: Challenges and Opportunities. IEEE Des. Test 32 (4) (2015)
Sourav Das, Dongjin Lee, Dae Hyun Kim, Partha Pratim Pande
Small-World Network Enabled Energy Efficient and Robust 3D NoC Architectures. ACM Great Lakes Symposium on VLSI (2015)
Dae Hyun Kim, Jong Tae Park
Investigation on stress induced hump phenomenon in IGZO thin film transistors under negative bias stress and illumination. Microelectron. Reliab. 55 (9-10) (2015)
Dae Hyun Kim, Sung Kyu Lim
Guest Editors' Introduction: Advances in 3-D Integrated Circuits, Systems, and CAD Tools. IEEE Des. Test 32 (4) (2015)
Dae Hyun Kim, Alexander H. Mun, Mohamed Omar
Chromatic Bounds on Orbital Chromatic Roots. Electron. J. Comb. 21 (4) (2014)
Muhammad Muqarrab Bashir, Chang-Chih Chen, Linda Milor, Dae Hyun Kim, Sung Kyu Lim
Backend Dielectric Reliability Full Chip Simulator. IEEE Trans. Very Large Scale Integr. Syst. 22 (8) (2014)
Dae Hyun Kim, Jong Tae Park
The effect of gate overlap on the device degradation in IGZO thin film transistors. Microelectron. Reliab. 54 (9-10) (2014)
Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, Sung Kyu Lim
Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs. ASP-DAC (2013)
Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim
Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout. IEEE Trans. Very Large Scale Integr. Syst. 21 (5) (2013)
Dae Hyun Kim, Sung Kyu Lim
Design Quality Trade-Off Studies for 3-D ICs Built With Sub-Micron TSVs and Future Devices. IEEE J. Emerg. Sel. Topics Circuits Syst. 2 (2) (2012)
Kaiyuan Yang, Dae Hyun Kim, Sung Kyu Lim
Design quality tradeoff studies for 3D ICs built with nano-scale TSVs and devices. ISQED (2012)
Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
3D-MAPS: 3D Massively parallel processor with stacked memory. ISSCC (2012)
Chang-Chih Chen, Fahad Ahmed, Dae Hyun Kim, Sung Kyu Lim, Linda Milor
Backend dielectric reliability simulator for microprocessor system. Microelectron. Reliab. 52 (9-10) (2012)
Dae Hyun Kim, Rasit Onur Topaloglu, Sung Kyu Lim
Block-level 3D IC design with through-silicon-via planning. ASP-DAC (2012)
Dae Hyun Kim, Rasit Onur Topaloglu, Sung Kyu Lim
TSV density-driven global placement for 3D stacked ICs. ISOCC (2011)
Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. ISQED (2011)
Muhammad Bashir, Linda Milor, Dae Hyun Kim, Sung Kyu Lim
Impact of irregular geometries on low-k dielectric breakdown. Microelectron. Reliab. 51 (9-11) (2011)
Michael B. Healy, Krit Athikulwongse, Rohan Goel, Mohammad M. Hossain, Dae Hyun Kim, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Moongon Jung, Brian Ouellette, Mohit Pathak, Hemant Sane, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory. CICC (2010)
Muhammad Bashir, Linda S. Milor, Dae Hyun Kim, Sung Kyu Lim
Methodology to determine the impact of linewidth variation on chip scale copper/low-k backend dielectric breakdown. Microelectron. Reliab. 50 (9-11) (2010)
Minki Cho, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Saibal Mukhopadhyay
Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system. ICCAD (2010)
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs. SLIP (2009)
Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim
A study of Through-Silicon-Via impact on the 3D stacked IC layout. ICCAD (2009)
Dae Hyun Kim, Myoung-Jun Kim
Design Method for Pen Input Environment. IEICE Trans. Inf. Syst. (1) (2009)
Dae Hyun Kim, Sung Kyu Lim
Bus-aware microarchitectural floorplanning. ASP-DAC (2008)
Dae Hyun Kim, Sung Kyu Lim
Global bus route optimization with application to microarchitectural design exploration. ICCD (2008)
Dae Hyun Kim, Myoung-Jun Kim
A curvature estimation for pen input segmentation in sketch-based modeling. Comput. Aided Des. 38 (3) (2006)
Dae Hyun Kim, Myoung-Jun Kim
Skin Color Analysis in HSV Color Space and Rendering with Fine Scale Skin Structure. Computer Graphics International (2006)
Dae Hyun Kim, Myoung-Jun Kim
A new modeling interface for the pen-input displays. Comput. Aided Des. 38 (3) (2006)

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Publication Activity (10 Years)

Top Topics

Top Venues

Dae Hyun Kim