Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system.
Minki ChoChang LiuDae Hyun KimSung Kyu LimSaibal MukhopadhyayPublished in: ICCAD (2010)
Keyphrases
- significant improvement
- pairwise
- computational cost
- test data
- tree structure
- preprocessing
- case study
- classification method
- clustering method
- segmentation algorithm
- model selection
- image compression
- experimental evaluation
- prior knowledge
- objective function
- similarity measure
- probabilistic model
- support vector machine
- signal processing
- dynamic programming
- computationally efficient
- test cases
- image segmentation
- image processing