Login / Signup

Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout.

Dae Hyun KimKrit AthikulwongseSung Kyu Lim
Published in: IEEE Trans. Very Large Scale Integr. Syst. (2013)
Keyphrases
  • low cost
  • main factors
  • data mining
  • simulation study
  • factors affecting
  • factors influencing
  • artificial intelligence
  • information systems
  • knowledge base
  • website
  • case study
  • empirical studies
  • factors affect