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Power, Performance, and Thermal Trade-offs in M3D-enabled Manycore Chips.

Shouvik MusavvirAnwesha ChatterjeeRyan Gary KimDae Hyun KimJanardhan Rao DoppaPartha Pratim Pande
Published in: DATE (2020)
Keyphrases
  • trade off
  • power consumption
  • chip design
  • high speed
  • infrared
  • high density
  • electrical power
  • neural network
  • case study
  • computational power
  • multi objective
  • integrated circuit
  • power plant
  • high end
  • thermal imaging