Mohit Pathak

Publication Activity (10 Years)

Years Active: 2004-2015
Publications (10 Years): 0

Top Topics

Memory Management

High Performance Computing

Processing Elements

Top Venues

IEEE Trans. Computers

Publications

Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory). IEEE Trans. Computers 64 (1) (2015)
Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim
Exploiting die-to-die thermal coupling in 3D IC placement. DAC (2012)
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang
Design for manufacturability and reliability for TSV-based 3D ICs. ASP-DAC (2012)
Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
3D-MAPS: 3D Massively parallel processor with stacked memory. ISSCC (2012)
Mohit Pathak, Jiwoo Pak, David Z. Pan, Sung Kyu Lim
Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs. ICCAD (2011)
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Kyu Lim
Through-silicon-via management during 3D physical design: When to add and how many? ICCAD (2010)
Michael B. Healy, Krit Athikulwongse, Rohan Goel, Mohammad M. Hossain, Dae Hyun Kim, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Moongon Jung, Brian Ouellette, Mohit Pathak, Hemant Sane, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory. CICC (2010)
Mohit Pathak, Sung Kyu Lim
Performance and Thermal-Aware Steiner Routing for 3-D Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 28 (9) (2009)
Mohit Pathak, Souvik Mukherjee, Madhavan Swaminathan, Ege Engin, Sung Kyu Lim
Placement and routing of RF embedded passive designs in LCP substrate. ICCD (2007)
Mohit Pathak, Sung Kyu Lim
Thermal-aware Steiner routing for 3D stacked ICs. ICCAD (2007)
Jacob R. Minz, Mohit Pathak, Sung Kyu Lim
Net and Pin Distribution for 3D Package Global Routing. DATE (2004)