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Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs.
Mohit Pathak
Jiwoo Pak
David Z. Pan
Sung Kyu Lim
Published in:
ICCAD (2011)
Keyphrases
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reliability analysis
high speed
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neural network
high density
artificial intelligence
artificial immune system
analog vlsi