Shreepad Panth

Publication Activity (10 Years)

Years Active: 2011-2017
Publications (10 Years): 5

Top Topics

Design Methodology

Magnetic Recording

Queue Management

Processing Elements

Top Venues

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36 (10) (2017)
Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim
Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36 (8) (2017)
Taigon Song, Shreepad Panth, Yoo-Jin Chae, Sung Kyu Lim
More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35 (12) (2016)
Kartik Acharya, Kyungwook Chang, Bon Woong Ku, Shreepad Panth, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim
Monolithic 3D IC design: Power, performance, and area impact at 7nm. ISQED (2016)
Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35 (10) (2016)
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications. DAC (2015)
Brandon Noia, Shreepad Panth, Krishnendu Chakrabarty, Sung Kyu Lim
Scan Test of Die Logic in 3-D ICs Using TSV Probing. IEEE Trans. Very Large Scale Integr. Syst. 23 (2) (2015)
Taigon Song, Shreepad Panth, Yoo-Jin Chae, Sung Kyu Lim
Three-Tier 3D ICs for More Power Reduction: Strategies in CAD, Design, and Bonding Selection. ICCAD (2015)
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34 (4) (2015)
Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory). IEEE Trans. Computers 64 (1) (2015)
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations. DAC (2014)
Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs. DAC (2014)
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
Placement-driven partitioning for congestion mitigation in monolithic 3D IC designs. ISPD (2014)
Shreepad Panth, Sandeep Kumar Samal, Yun Seop Yu, Sung Kyu Lim
Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs. J. Inform. and Commun. Convergence Engineering 12 (3) (2014)
Shreepad Panth, Kambiz Samadi, Sung Kyu Lim
Test-TSV estimation during 3D-IC partitioning. 3DIC (2013)
Junghee Lee, Chrysostomos Nicopoulos, Hyung Gyu Lee, Shreepad Panth, Sung Kyu Lim, Jongman Kim
IsoNet: Hardware-Based Job Queue Management for Many-Core Architectures. IEEE Trans. Very Large Scale Integr. Syst. 21 (6) (2013)
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
High-density integration of functional modules using monolithic 3D-IC technology. ASP-DAC (2013)
Shreepad Panth, Sung Kyu Lim
Transition delay fault testing of 3D ICs with IR-drop study. VTS (2012)
Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
3D-MAPS: 3D Massively parallel processor with stacked memory. ISSCC (2012)
Brandon Noia, Shreepad Panth, Krishnendu Chakrabarty, Sung Kyu Lim
Scan test of die logic in 3D ICs using TSV probing. ITC (2012)
Sergej Deutsch, Krishnendu Chakrabarty, Shreepad Panth, Sung Kyu Lim
TSV Stress-Aware ATPG for 3D Stacked ICs. Asian Test Symposium (2012)
Shreepad Panth, Sung Kyu Lim
Scan chain and power delivery network synthesis for pre-bond test of 3D ICs. VTS (2011)
Dean L. Lewis, Shreepad Panth, Xin Zhao, Sung Kyu Lim, Hsien-Hsin S. Lee
Designing 3D test wrappers for pre-bond and post-bond test of 3D embedded cores. ICCD (2011)