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Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs.
Shreepad Panth
Sandeep Kumar Samal
Yun Seop Yu
Sung Kyu Lim
Published in:
J. Inform. and Commun. Convergence Engineering (2014)
Keyphrases
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high density
low density
building blocks
design principles
case study
data center
high power
general purpose
cost effective
real world
knowledge based systems
design decisions
high speed
thin film
user interface
magnetic tape
magnetic recording