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Three-Tier 3D ICs for More Power Reduction: Strategies in CAD, Design, and Bonding Selection.

Taigon SongShreepad PanthYoo-Jin ChaeSung Kyu Lim
Published in: ICCAD (2015)
Keyphrases
  • power reduction
  • computer aided
  • design process
  • computer aided design
  • case study
  • peer to peer
  • power consumption
  • power dissipation