Bon Woong Ku

Publication Activity (10 Years)

Years Active: 2015-2022
Publications (10 Years): 20

Top Topics

Liquid State Machine

Cosine Similarity

Physical Design

Top Venues

Publications

Bon Woong Ku, Catherine D. Schuman, Md Musabbir Adnan, Tiffany M. Mintz, Raphael C. Pooser, Kathleen E. Hamilton, Garrett S. Rose, Sung Kyu Lim
Unsupervised Digit Recognition Using Cosine Similarity In A Neuromemristive Competitive Learning System. ACM J. Emerg. Technol. Comput. Syst. 18 (2) (2022)
Arjun Chaudhuri, Sanmitra Banerjee, Jinwoo Kim, Heechun Park, Bon Woong Ku, Sukeshwar Kannan, Krishnendu Chakrabarty, Sung Kyu Lim
Built-in Self-Test and Fault Localization for Inter-Layer Vias in Monolithic 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 18 (1) (2022)
Sai Surya Kiran Pentapati, Bon Woong Ku, Sung Kyu Lim
ML-Based Wire RC Prediction in Monolithic 3D ICs with an Application to Full-Chip Optimization. ISPD (2021)
Heechun Park, Bon Woong Ku, Kyungwook Chang, Da Eun Shim, Sung Kyu Lim
Pseudo-3D Physical Design Flow for Monolithic 3D ICs: Comparisons and Enhancements. ACM Trans. Design Autom. Electr. Syst. 26 (5) (2021)
Heechun Park, Bon Woong Ku, Kyungwook Chang, Da Eun Shim, Sung Kyu Lim
Pseudo-3D Approaches for Commercial-Grade RTL-to-GDS Tool Flow Targeting Monolithic 3D ICs. ISPD (2020)
Bon Woong Ku, Sung Kyu Lim
Pin-in-the-middle: an efficient block pin assignment methodology for block-level monolithic 3D ICs. ISLPED (2020)
Bon Woong Ku, Kyungwook Chang, Sung Kyu Lim
Compact-2D: A Physical Design Methodology to Build Two-Tier Gate-Level 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39 (6) (2020)
Heechun Park, Kyungwook Chang, Bon Woong Ku, Jinwoo Kim, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Saibal Mukhopadhyay, Krishnendu Chakrabarty, Sung Kyu Lim
RTL-to-GDS Tool Flow and Design-for-Test Solutions for Monolithic 3D ICs. DAC (2019)
Arjun Chaudhuri, Sanmitra Banerjee, Heechun Park, Bon Woong Ku, Krishnendu Chakrabarty, Sung Kyu Lim
Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs. ETS (2019)
Bon Woong Ku, Yu Liu, Yingyezhe Jin, Sandeep Kumar Samal, Peng Li, Sung Kyu Lim
Design and architectural co-optimization of monolithic 3D liquid state machine-based neuromorphic processor. DAC (2018)
Bon Woong Ku, Yu Liu, Yingyezhe Jin, Peng Li, Sung Kyu Lim
Area-efficient and low-power face-to-face-bonded 3D liquid state machine design. ICCAD (2018)
Bon Woong Ku, Kyungwook Chang, Sung Kyu Lim
Compact-2D: A Physical Design Methodology to Build Commercial-Quality Face-to-Face-Bonded 3D ICs. ISPD (2018)
Md Musabbir Adnan, Sagarvarma Sayyaparaju, Garrett S. Rose, Catherine D. Schuman, Bon Woong Ku, Sung Kyu Lim
A Twin Memristor Synapse for Spike Timing Dependent Learning in Neuromorphic Systems. SoCC (2018)
Kyungwook Chang, Bon Woong Ku, Saurabh Sinha, Sung Kyu Lim
Full-chip monolithic 3D IC design and power performance analysis with ASAP7 library: (Invited Paper). ICCAD (2017)
Bon Woong Ku, Taigon Song, Arthur Nieuwoudt, Sung Kyu Lim
Transistor-level monolithic 3D standard cell layout optimization for full-chip static power integrity. ISLPED (2017)
Austin Wyer, Md Musabbir Adnan, Bon Woong Ku, Sung Kyu Lim, Catherine D. Schuman, Raphael C. Pooser, Garrett S. Rose
Evaluating online-learning in memristive neuromorphic circuits. NCS (2017)
Bon Woong Ku, Peter Debacker, Dragomir Milojevic, Praveen Raghavan, Diederik Verkest, Aaron Thean, Sung Kyu Lim
Physical Design Solutions to Tackle FEOL/BEOL Degradation in Gate-level Monolithic 3D ICs. ISLPED (2016)
Kartik Acharya, Kyungwook Chang, Bon Woong Ku, Shreepad Panth, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim
Monolithic 3D IC design: Power, performance, and area impact at 7nm. ISQED (2016)
Bon Woong Ku, Peter Debacker, Dragomir Milojevic, Praveen Raghavan, Sung Kyu Lim
How much cost reduction justifies the adoption of monolithic 3D ICs at 7nm node? ICCAD (2016)
Yarui Peng, Bon Woong Ku, Youn-Sik Park, Kwang-Il Park, Seong-Jin Jang, Joo-Sun Choi, Sung Kyu Lim
Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM. DAC (2015)