INTER LAYER
Experts
- Thomas Wiegand
- Rik Van de Walle
- Jan De Cock
- Feng Wu
- Thomas Schierl
- Heiko Schwarz
- Rosario Garrido-Cantos
- Sebastiaan Van Leuven
- Cornelius Hellge
- Takeshi Ikenaga
- Wen Gao
- C.-C. Jay Kuo
- José Luis Martínez
- Peter Lambert
- Shipeng Li
- Houqiang Li
- Mathias Wien
- Davy De Schrijver
- Pedro Cuenca
- Wesley De Neve
- Lei Sun
- Detlev Marpe
- Yongjin Cho
- Jiaying Liu
- Lajos Hanzo
- Hsueh-Ming Hang
- Wen-Hsiao Peng
- Koen De Wolf
- Zhenyu Liu
- Zongming Guo
- Xiaoyan Sun
- Sam Kwong
- Marta Karczewicz
- Shan Liu
- Mary L. Comer
- Xiaoqun Wu
- Kenneth Rose
- Yuwen He
- Meng-Ping Kao
Venues
- CoRR
- ICIP
- IEEE Trans. Circuits Syst. Video Technol.
- ISCAS
- ICME
- PCS
- VCIP
- IEEE Trans. Consumer Electron.
- IEEE Access
- ICIP (2)
- ICASSP
- J. Vis. Commun. Image Represent.
- EUSIPCO
- IEEE Trans. Image Process.
- MMSP
- Signal Process. Image Commun.
- Multim. Tools Appl.
- IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
- DCC
- IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
- EURASIP J. Adv. Signal Process.
- Sensors
- Remote. Sens.
- ACM Multimedia
- IEEE Trans. Broadcast.
- MobiMedia
- ICCAD
- IEICE Trans. Commun.
- IEEE Trans. Multim.
- IROS
- CVPR
- WCNC
- ICIP (1)
- ICCE
- PCM
- IEEE Signal Process. Lett.
- RFC
- ICRA
- ISIT
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