Area-efficient and low-power face-to-face-bonded 3D liquid state machine design.

Bon Woong Ku Yu Liu Yingyezhe Jin Peng Li Sung Kyu Lim

Published in: ICCAD (2018)

Keyphrases

low power
low cost
single chip
low power consumption
power consumption
logic circuits
high speed
vlsi architecture
gate array
digital signal processing
ultra low power
cmos technology
power dissipation
power reduction
vlsi circuits
design process
hardware and software
image processing
genetic algorithm