Yang Du

Publication Activity (10 Years)

Years Active: 2013-2017
Publications (10 Years): 9

Top Topics

Physical Design

Partitioning Algorithm

Congestion Avoidance

Top Venues

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

Publications

Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36 (10) (2017)
Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim
Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36 (8) (2017)
Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim
Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36 (6) (2017)
Wei-Ting Jonas Chan, Yang Du, Andrew B. Kahng, Siddhartha Nath, Kambiz Samadi
BEOL stack-aware routability prediction from placement using data mining techniques. ICCD (2016)
Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35 (10) (2016)
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications. DAC (2015)
Wei-Ting Jonas Chan, Siddhartha Nath, Andrew B. Kahng, Yang Du, Kambiz Samadi
3DIC benefit estimation and implementation guidance from 2DIC implementation. DAC (2015)
Karim Arabi, Kambiz Samadi, Yang Du
3D VLSI: A Scalable Integration Beyond 2D. ISPD (2015)
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34 (4) (2015)
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations. DAC (2014)
Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs. DAC (2014)
Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim
Full chip impact study of power delivery network designs in monolithic 3D ICs. ICCAD (2014)
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
Placement-driven partitioning for congestion mitigation in monolithic 3D IC designs. ISPD (2014)
Shreepad A. Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
Design and CAD methodologies for low power gate-level monolithic 3D ICs. ISLPED (2014)
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
High-density integration of functional modules using monolithic 3D-IC technology. ASP-DAC (2013)